Nickel Salt Dependency as Catalyst in the Plating Bath on the Film Properties of Cu/Cu-Ni
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Keywords:
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Cathode Current Efficiency, Deposition Rate, Electrodeposition, Corrosion, Hardness
Abstract
Metal plating frequently employs nickel (Ni) and copper (Cu) as anodes. Cu/ Cu-Ni film formed has many advantages, such as better corrosion resistance and high hardness characteristics. This study aims to assess the properties of Cu/Cu-Ni film, such as phase, surface morphology, crystallographic orientation, hardness, corrosion analysis, and contact angle, which were fabricated using electrodeposition with various Ni salt additions (0.3, 0.5 and 0.7 M). In addition, the cathode current efficiency (CCE) and deposition rate of the Cu/Cu-Ni electrodeposition were also investigated. An increase in Ni salt in the plating bath could enhance the pH, promoting higher CCE and depleting hydrogen evolution at the cathode, leading to the presenting Ni phase in the alloy. The higher concentration of Ni salt in the solution could also enhance the deposition rate due to a shift to a pH value, which affects the roughening of the surface morphology, promoting a higher contact angle. All crystal structures generated by Cu/Cu-Ni electrodeposition were FCC, with the preferred orientation of the (111) plane. Crystallite size and lattice strain depend on the deposition rate. Less crystallite size and lattice strain affect the film’s hardness and corrosion resistance. Moreover, the third bath had the resulting Cu-Ni layer with the best hardness and corrosion rate of around 136 HV and 0.081 mmpy.
References
Ahmad, Z. (2006). Principles of Corrosion Engineering and Corrosion Control. 1th edition. Elsevier
Al Kharafi, F., I. Ghayad, and R. Abdullah (2012). Corrosion Inhibition of Copper in Non-Polluted and Polluted Sea Water Using 5-Phenyl-1-H-Tetrazole. International Journal of Electrochemical Science, 7(4); 3289–3298
Augustin, A., P. Huilgol, K. R. Udupa, and U. Bhat (2016). Effect of Current Density during Electrodeposition on Microstructure and Hardness of Textured Cu Coating in the Application of Antimicrobial Al Touch Surface. Journal of the mechanical behavior of Biomedical materials, 63(October); 352–360
Baskaran, I., T. S. Narayanan, and A. Stephen (2006). Pulsed Electrodeposition of Nanocrystalline Cu–Ni Alloy Films and Evaluation of Their Characteristic Properties. Materials Letters, 60(16); 1990–1995
Basori, B. Soegijono, and F. Susetyo (2022). Magnetic Field Exposure on Electroplating Process of Ferromagnetic Nickel Ion on Copper Substrate. In Journal of Physics: Conference Series, volume 2377. IOP Publishing, page 012002
Basori, B., B. Soegijono, S. Yudanto, D. Nanto, and F. Susetyo (2023). Effect of Low Magnetic Field during Nickel Electroplating on Morphology, Structure, and Hardness. In Journal of Physics: Conference Series, volume 2596. IOP Publishing, page 012014
Dai, P., C. Zhang, J. Wen, H. Rao, and Q. Wang (2016). Tensile Properties of Electrodeposited Nanocrystalline Ni-Cu Alloys. Journal of Materials Engineering and Performance, 25(January); 594–600
Deo, Y., S. Guha, K. Sarkar, P. Mohanta, D. Pradhan, and A. Mondal (2020). Electrodeposited Ni-Cu Alloy Coatings on Mild Steel for Enhanced Corrosion Properties. Applied Surface Science, 515(June); 146078
Ganesan, M., C.-C. Liu, S. Pandiyarajan, C.-T. Lee, and H.-C. Chuang (2022). Post-Supercritical CO2 Electrodeposition Approach for Ni-Cu Alloy Fabrication: An Innovative Eco-Friendly Strategy for High-Performance Corrosion Resistance with Durability. Applied Surface Science, 577(1); 151955
Ghosh, S., A. Grover, G. Dey, U. Kulkarni, R. Dusane, A. Suri, and S. Banerjee (2006). Structural Characterization of Electrodeposited Nanophase Ni–Cu Alloys. Journal of Materials Research, 21(1); 45–61
Ghosh, S., A. Grover, G. Dey, and M. Totlani (2000). Nanocrystalline Ni–Cu Alloy Plating by Pulse Electrolysis. Surface and Coatings Technology, 126(1); 48–63
Gomez, E., S. Pane, and E. Valles (2005). Electrodeposition of Co–Ni and Co–Ni–Cu Systems in Sulphate–Citrate Medium. Electrochimica Acta, 51(1); 146–153
Goranova, D., R. Rashkov, G. Avdeev, and V. Tonchev (2016). Electrodeposition of Ni–Cu Alloys at High Current Densities: Details of the Elements Distribution. Journal of Materials Science, 51(June); 8663–8673
Güler, E. S., E. Konca, and İ. Karakaya (2013). Effect of Electrodeposition Parameters on the Current Density of Hydrogen Evolution Reaction in Ni and Ni-MoS2 Composite Coatings. International Journal of Electrochemical Science, 8(4); 5496–5505
Hacıismailoğlu, M. Ş. and M. Alper (2011). Effect of Electrolyte pH and Cu Concentration on Microstructure of Electrodeposited Ni-Cu Alloy Films. Surface and Coatings Technology, 206(6); 1430–1438
Hakim, M. S. and H. Pangestu (2022). Preparation and Application of Nickel Electroplating on Copper (Ni/EC) Electrode for Glucose Detection. Science and Technology Indonesia, 7(2); 208–212
Huang, X. and I. Gates (2020). Apparent Contact Angle around the Periphery of a Liquid Drop on Roughened Surfaces. Scientific Reports, 10(1); 8220
Jariwala, F., R. Gohil, P. Trivedi, J. Parmar, B. Borda, S. Patel, B. Goyal, and V. Rao (2018). Electroplating of Nickel and Chromium on Aluminum 6082-T6 Alloy. Proceedings of the International Conference on Recent Advances in Metallurgy for Sustainable Development, pages 1–3
Kalubowila, K., K. Jayathileka, L. Kumara, K. Ohara, S. Kohara, O. Sakata, M. Gunewardene, J. Jayasundara, D. Dissanayake, and J. Jayanetti (2019). Effect of Bath pH on Electronic and Morphological Properties of Electrodeposited Cu2O Thin Films. Journal of The Electrochemical Society, 166(4); D113
Kukliński, M., A. Bartkowska, D. Przestacki, and G. Kinal (2020). Influence of Microstructure and Chemical Composition on Microhardness and Wear Properties of Laser Borided Monel 400. Materials, 13(24); 5757
Lajevardi, S., T. Shahrabi, J. Szpunar, A. S. Rouhaghdam, and S. Sanjabi (2013). Characterization of the Microstructure and Texture of Functionally Graded Nickel-Al2O3 Nano Composite Coating Produced by Pulse Deposition. Surface and Coatings Technology, 232(October); 851–859
Lee, J. M., K. M. Bae, K. K. Jung, J. H. Jeong, and J. S. Ko (2014). Creation of Microstructured Surfaces Using Cu–Ni Composite Electrodeposition and Their Application to Superhydrophobic Surfaces. Applied Surface Science, 289(January); 14–20
Matsuda, T., R. Saeki, M. Hayashida, and T. Ohgai (2022). Microhardness and Heat-Resistance Performance of Ferromagnetic Cobalt-Molybdenum Nanocrystals Electrodeposited from an Aqueous Solution Containing Citric Acid. Materials Research Express, 9(4); 046502
Nady, H. and M. Negem (2016). Ni-Cu Nano-Crystalline Alloys for Efficient Electrochemical Hydrogen Production in Acid Water. RSC Advances, 6(56); 51111–51119
Ollivier, A., L. Muhr, S. Delbos, P. Grand, M. Matlosz, and E. Chassaing (2009). Copper–Nickel = Codeposition As a Model for Mass-Transfer Characterization in Copper–Indium–Selenium Thin Film Production. Journal of Applied Electrochemistry, 39(May); 2337–2344
Park, B. N., Y. S. Sohn, and S. Y. Choi (2008). Effects of a Magnetic Field on the Copper Metallization Using the Electroplating Process. Microelectronic Engineering, 85(2); 308–314
Rosyidan, C., B. Kurniawan, B. Soegijono, V. Vidia Putra, D. R. Munazat, and F. B. Susetyo (2024). Effect of Current Density on Magnetic and Hardness Properties of Ni-Cu Alloy Coated on Al Via Electrodeposition. International Journal of Engineering, 37(2); 213–223
Sarac, U., R. M. Öksüzoğlu, and M. C. Baykul (2012). Deposition Potential Dependence of Composition, Microstructure, and Surface Morphology of Electrodeposited Ni–Cu Alloy Films. Journal of Materials Science: Materials in Electronics, 23(April); 2110–2116
Seakr, R. (2017). Microstructure and Crystallographic Characteristics of Nanocrystalline Copper Prepared from Acetate Solutions by Electrodeposition Technique. Transactions of Nonferrous Metals Society of China, 27(6); 1423–1430
Setiamukti, D., A. Khusnani, and M. Toifur (2020). The Effect of Electrolyte Concentration on the Sensitivity of Low-Temperature Sensor Performance of Cu/ni Film. Science and Technology Indonesia, 5(2); 28–33
Silaimani, S., G. Vivekanandan, and P. Veeramani (2015). Nano-Nickel-Copper Alloy Deposit for Improved Corrosion Resistance in Marine Environment. International Journal of Environmental Science and Technology, 12(May); 2299–2306
Thurber, C. R., Y. H. Ahmad, S. F. Sanders, A. Al-Shenawa, N. D’Souza, A. M. Mohamed, and T. D. Golden (2016). Electrodeposition of 70-30 Cu-Ni Nanocomposite Coatings for Enhanced Mechanical and Corrosion Properties. Current Applied Physics, 16(3); 387–396
Wang, S., X. Guo, H. Yang, J. Dai, R. Zhu, J. Gong, L. Peng, and W. Ding (2014). Electrodeposition Mechanism and Characterization of Ni-Cu Alloy Coatings from a Eutectic Based Ionic Liquid. Applied Surface Science, 288(January); 530–536
Yu, Q., Z. Zeng, W. Zhao, M. Li, X. Wu, and Q. Xue (2013). Fabrication of Adhesive Superhydrophobic Ni-Cu-P Alloy Coatings with High Mechanical Strength by One Step Electrodeposition. Colloids and Surfaces A: Physicochemical and Engineering Aspects, 427(June); 1–6
Al Kharafi, F., I. Ghayad, and R. Abdullah (2012). Corrosion Inhibition of Copper in Non-Polluted and Polluted Sea Water Using 5-Phenyl-1-H-Tetrazole. International Journal of Electrochemical Science, 7(4); 3289–3298
Augustin, A., P. Huilgol, K. R. Udupa, and U. Bhat (2016). Effect of Current Density during Electrodeposition on Microstructure and Hardness of Textured Cu Coating in the Application of Antimicrobial Al Touch Surface. Journal of the mechanical behavior of Biomedical materials, 63(October); 352–360
Baskaran, I., T. S. Narayanan, and A. Stephen (2006). Pulsed Electrodeposition of Nanocrystalline Cu–Ni Alloy Films and Evaluation of Their Characteristic Properties. Materials Letters, 60(16); 1990–1995
Basori, B. Soegijono, and F. Susetyo (2022). Magnetic Field Exposure on Electroplating Process of Ferromagnetic Nickel Ion on Copper Substrate. In Journal of Physics: Conference Series, volume 2377. IOP Publishing, page 012002
Basori, B., B. Soegijono, S. Yudanto, D. Nanto, and F. Susetyo (2023). Effect of Low Magnetic Field during Nickel Electroplating on Morphology, Structure, and Hardness. In Journal of Physics: Conference Series, volume 2596. IOP Publishing, page 012014
Dai, P., C. Zhang, J. Wen, H. Rao, and Q. Wang (2016). Tensile Properties of Electrodeposited Nanocrystalline Ni-Cu Alloys. Journal of Materials Engineering and Performance, 25(January); 594–600
Deo, Y., S. Guha, K. Sarkar, P. Mohanta, D. Pradhan, and A. Mondal (2020). Electrodeposited Ni-Cu Alloy Coatings on Mild Steel for Enhanced Corrosion Properties. Applied Surface Science, 515(June); 146078
Ganesan, M., C.-C. Liu, S. Pandiyarajan, C.-T. Lee, and H.-C. Chuang (2022). Post-Supercritical CO2 Electrodeposition Approach for Ni-Cu Alloy Fabrication: An Innovative Eco-Friendly Strategy for High-Performance Corrosion Resistance with Durability. Applied Surface Science, 577(1); 151955
Ghosh, S., A. Grover, G. Dey, U. Kulkarni, R. Dusane, A. Suri, and S. Banerjee (2006). Structural Characterization of Electrodeposited Nanophase Ni–Cu Alloys. Journal of Materials Research, 21(1); 45–61
Ghosh, S., A. Grover, G. Dey, and M. Totlani (2000). Nanocrystalline Ni–Cu Alloy Plating by Pulse Electrolysis. Surface and Coatings Technology, 126(1); 48–63
Gomez, E., S. Pane, and E. Valles (2005). Electrodeposition of Co–Ni and Co–Ni–Cu Systems in Sulphate–Citrate Medium. Electrochimica Acta, 51(1); 146–153
Goranova, D., R. Rashkov, G. Avdeev, and V. Tonchev (2016). Electrodeposition of Ni–Cu Alloys at High Current Densities: Details of the Elements Distribution. Journal of Materials Science, 51(June); 8663–8673
Güler, E. S., E. Konca, and İ. Karakaya (2013). Effect of Electrodeposition Parameters on the Current Density of Hydrogen Evolution Reaction in Ni and Ni-MoS2 Composite Coatings. International Journal of Electrochemical Science, 8(4); 5496–5505
Hacıismailoğlu, M. Ş. and M. Alper (2011). Effect of Electrolyte pH and Cu Concentration on Microstructure of Electrodeposited Ni-Cu Alloy Films. Surface and Coatings Technology, 206(6); 1430–1438
Hakim, M. S. and H. Pangestu (2022). Preparation and Application of Nickel Electroplating on Copper (Ni/EC) Electrode for Glucose Detection. Science and Technology Indonesia, 7(2); 208–212
Huang, X. and I. Gates (2020). Apparent Contact Angle around the Periphery of a Liquid Drop on Roughened Surfaces. Scientific Reports, 10(1); 8220
Jariwala, F., R. Gohil, P. Trivedi, J. Parmar, B. Borda, S. Patel, B. Goyal, and V. Rao (2018). Electroplating of Nickel and Chromium on Aluminum 6082-T6 Alloy. Proceedings of the International Conference on Recent Advances in Metallurgy for Sustainable Development, pages 1–3
Kalubowila, K., K. Jayathileka, L. Kumara, K. Ohara, S. Kohara, O. Sakata, M. Gunewardene, J. Jayasundara, D. Dissanayake, and J. Jayanetti (2019). Effect of Bath pH on Electronic and Morphological Properties of Electrodeposited Cu2O Thin Films. Journal of The Electrochemical Society, 166(4); D113
Kukliński, M., A. Bartkowska, D. Przestacki, and G. Kinal (2020). Influence of Microstructure and Chemical Composition on Microhardness and Wear Properties of Laser Borided Monel 400. Materials, 13(24); 5757
Lajevardi, S., T. Shahrabi, J. Szpunar, A. S. Rouhaghdam, and S. Sanjabi (2013). Characterization of the Microstructure and Texture of Functionally Graded Nickel-Al2O3 Nano Composite Coating Produced by Pulse Deposition. Surface and Coatings Technology, 232(October); 851–859
Lee, J. M., K. M. Bae, K. K. Jung, J. H. Jeong, and J. S. Ko (2014). Creation of Microstructured Surfaces Using Cu–Ni Composite Electrodeposition and Their Application to Superhydrophobic Surfaces. Applied Surface Science, 289(January); 14–20
Matsuda, T., R. Saeki, M. Hayashida, and T. Ohgai (2022). Microhardness and Heat-Resistance Performance of Ferromagnetic Cobalt-Molybdenum Nanocrystals Electrodeposited from an Aqueous Solution Containing Citric Acid. Materials Research Express, 9(4); 046502
Nady, H. and M. Negem (2016). Ni-Cu Nano-Crystalline Alloys for Efficient Electrochemical Hydrogen Production in Acid Water. RSC Advances, 6(56); 51111–51119
Ollivier, A., L. Muhr, S. Delbos, P. Grand, M. Matlosz, and E. Chassaing (2009). Copper–Nickel = Codeposition As a Model for Mass-Transfer Characterization in Copper–Indium–Selenium Thin Film Production. Journal of Applied Electrochemistry, 39(May); 2337–2344
Park, B. N., Y. S. Sohn, and S. Y. Choi (2008). Effects of a Magnetic Field on the Copper Metallization Using the Electroplating Process. Microelectronic Engineering, 85(2); 308–314
Rosyidan, C., B. Kurniawan, B. Soegijono, V. Vidia Putra, D. R. Munazat, and F. B. Susetyo (2024). Effect of Current Density on Magnetic and Hardness Properties of Ni-Cu Alloy Coated on Al Via Electrodeposition. International Journal of Engineering, 37(2); 213–223
Sarac, U., R. M. Öksüzoğlu, and M. C. Baykul (2012). Deposition Potential Dependence of Composition, Microstructure, and Surface Morphology of Electrodeposited Ni–Cu Alloy Films. Journal of Materials Science: Materials in Electronics, 23(April); 2110–2116
Seakr, R. (2017). Microstructure and Crystallographic Characteristics of Nanocrystalline Copper Prepared from Acetate Solutions by Electrodeposition Technique. Transactions of Nonferrous Metals Society of China, 27(6); 1423–1430
Setiamukti, D., A. Khusnani, and M. Toifur (2020). The Effect of Electrolyte Concentration on the Sensitivity of Low-Temperature Sensor Performance of Cu/ni Film. Science and Technology Indonesia, 5(2); 28–33
Silaimani, S., G. Vivekanandan, and P. Veeramani (2015). Nano-Nickel-Copper Alloy Deposit for Improved Corrosion Resistance in Marine Environment. International Journal of Environmental Science and Technology, 12(May); 2299–2306
Thurber, C. R., Y. H. Ahmad, S. F. Sanders, A. Al-Shenawa, N. D’Souza, A. M. Mohamed, and T. D. Golden (2016). Electrodeposition of 70-30 Cu-Ni Nanocomposite Coatings for Enhanced Mechanical and Corrosion Properties. Current Applied Physics, 16(3); 387–396
Wang, S., X. Guo, H. Yang, J. Dai, R. Zhu, J. Gong, L. Peng, and W. Ding (2014). Electrodeposition Mechanism and Characterization of Ni-Cu Alloy Coatings from a Eutectic Based Ionic Liquid. Applied Surface Science, 288(January); 530–536
Yu, Q., Z. Zeng, W. Zhao, M. Li, X. Wu, and Q. Xue (2013). Fabrication of Adhesive Superhydrophobic Ni-Cu-P Alloy Coatings with High Mechanical Strength by One Step Electrodeposition. Colloids and Surfaces A: Physicochemical and Engineering Aspects, 427(June); 1–6
Authors
Rosyidan, C., Kurniawan, B. ., Soegijono, B. ., Maulani, M. ., Samura, L., Nababan, F. G. ., Putra, V. G. V. ., & Susetyo, F. B. . (2024). Nickel Salt Dependency as Catalyst in the Plating Bath on the Film Properties of Cu/Cu-Ni. Science and Technology Indonesia, 9(3), 529–538. https://doi.org/10.26554/sti.2024.9.3.529-538
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